发明名称 |
SOLDER COMPOSITION, CONNECTING PROCESS WITH SOLDERING, AND CONNECTION STRUCTURE WITH SOLDERING |
摘要 |
<p>There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which changes to be in its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin, wherein a temperature at which the solid resin changes to be in the liquid-like state is lower than a temperature at which the thermosetting resin starts to cure.</p> |
申请公布号 |
KR20070049169(A) |
申请公布日期 |
2007.05.10 |
申请号 |
KR20077004168 |
申请日期 |
2007.02.22 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
WADA YOSHIYUKI;SAKAI TADAHIKO;YOSHINAGA SEIICHI |
分类号 |
B23K35/36;B23K35/02;C22C12/00;H05K3/34 |
主分类号 |
B23K35/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|