发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 <p>Provided is a semiconductor device having a high withstand voltage and high reliability even with a thin gate electrode. The semiconductor device is provided with a structure wherein a polycrystalline semiconductor layer, a gate insulating film and the gate electrode are successively stacked on an insulating substrate. In the stacked structure of the semiconductor device, the polycrystalline semiconductor layer has a surface roughness of 9nm or less, and the gate insulating film has a silicon oxide film on the polycrystalline semiconductor layer side and a film composed of a material having a dielectric constant higher than that of the silicon oxide on the gate electrode side.</p>
申请公布号 WO2007052393(A1) 申请公布日期 2007.05.10
申请号 WO2006JP314552 申请日期 2006.07.24
申请人 SHARP KABUSHIKI KAISHA;MATSUKIZONO, HIROSHI 发明人 MATSUKIZONO, HIROSHI
分类号 H01L29/786;H01L21/20;H01L21/336 主分类号 H01L29/786
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