| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device at lower manufacturing costs than before without enlarging the outer shape size of a package. <P>SOLUTION: On a substrate 1, substrate inner leads 2 are formed in the same pitch as that of electrode pads 4 on a semiconductor chip 3. The electrode pads 4 are connected to the substrate inner leads 2 by wirings 5. The substrate inner leads 2 and electrode pads 4 are each formed with bonding balls 7b. The bonding ball 7b on the substrate inner lead 2 has a diameter larger than the line width of the substrate inner lead 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
