| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the emission point interval between semiconductor lasers while securing heat radiation properties. <P>SOLUTION: A semiconductor laser having a different oscillation wavelength is packaged on both the surfaces of a base material 110 via a submount, and at least the thickness of the packaging region of the semiconductor laser in the base material 110 and the submount is made smaller than a prescribed thickness, thus securing heat radiation properties and reducing the emission point interval between semiconductor lasers. By packaging a semiconductor laser having a different oscillation wavelength on both the surfaces of the submount and reducing the thickness of the packaging region of at least the semiconductor laser of the submount as compared with a prescribed thickness, heat radiation properties are secured and the emission point interval can be reduced between the semiconductor lasers. <P>COPYRIGHT: (C)2007,JPO&INPIT |
