| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interposer substrate that is created to be extremely thin and uses a plurality of films as insulating layers. <P>SOLUTION: Two film substrates using films 210a, 210b are laminated by using a prepreg and a paste connection layer 250, where conductive paste is filled into the through-hole of the prepreg. Inner-layer wires 230a, 230b are connected electrically by the paste connection layer. Electrodes 110, 120 formed in a hole 260 formed on the uppermost surface layer are set to be the mounting sections of semiconductor mounting, or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
