发明名称 THERMAL FORMING SYSTEM AND ACTIVE COOLING PROCESS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermal forming system (10) and an active cooling process for actively cooling a workpiece (12) during the laser forming. <P>SOLUTION: The thermal forming system and the process for actively cooling a workpiece during the laser forming generally include adapting nozzles (14, 30, 100) of the laser forming system (10) to simultaneously form liquid curtains (24, 112) about gas channels (20, 110), wherein thermal energy produced by the thermal forming system propagates through the gas channels (20, 110) and onto the workpiece (12). <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007111773(A) 申请公布日期 2007.05.10
申请号 JP20060221747 申请日期 2006.08.16
申请人 GENERAL ELECTRIC CO <GE> 发明人 ZHANG WENWU;GRAHAM MICHAEL EVANS;JONES MARSHALL G
分类号 B23K26/06;B23K26/14 主分类号 B23K26/06
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