| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer structure with a mirror shot area. SOLUTION: This wafer structure is equipped with a first mirror shot area for which a mirror shot is applied, and the position of a first die is sought using the first mirror shot area as a reference. The wafer is further equipped with a second mirror shot area for which a mirror shot is applied. The first shot area and second shot area are mutually located in the direction of a diagonal line, and a mirror shot is performed on a wafer where a full shot is performed. A die attachment component is a wafer structure that can correctly recognize the first die making use of the first mirror shot area and second mirror shot area. Therefore, decline in yield due to the error of the first die recognition can be suppressed since the first die can be recognized correctly. COPYRIGHT: (C)2007,JPO&INPIT
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