| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor-element mounting package substrate whereby the formation of its IVH is made easy, and its connecting reliability is made excellent. SOLUTION: The manufacturing method for a semiconductor-element mounting package substrate has a process for forming an unpierced connecting hole. In this method, copper foil subjected to no roughening is so used on the surface of a copper clad laminate used in the semiconductor-element mounting package substrate which is opposed to its prepreg, as to reflect easily a laser beam by the surface when performing laser machining, and as to remove easily resin residues by preventing a connecting hole from piercing through the laminate. COPYRIGHT: (C)2007,JPO&INPIT
|
