| 摘要 |
A wafer processing method for dividing a wafer having devices which are formed in areas sectioned by a plurality of streets formed in a lattice pattern on the front surface, along the streets, comprising a protective tape affixing step for putting a protective tape whose adhesive force is reduced by an external stimulus, on the front surface of the wafer; a rear surface grinding step for grinding the rear surface of the wafer having the protective tape to a predetermined thickness; a wafer supporting step for supporting the rear surface of the wafer subjected to the rear surface grinding step by a wafer supporting means; a dividing step for dividing the wafer supported by the wafer supporting means into individual chips along the streets together with the protective tape; and an adhesive force reducing step for reducing the adhesive force of the protective tape by providing an external stimulus to the protective tape in a state where the wafer divided into individual chips by the dividing step is supported by the wafer supporting means.
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