APPARATUS AND METHOD FOR REMOVING FOREIGN MATTER FROM HEAT TREATMENT FURNACE AND METHOD FOR HEAT-TREATING WAFER

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for removing foreign matter from a heat treatment furnace, in each of which foreign matter such as a broken piece of a wafer remaining in the heat treatment furnace can be removed efficiently without removing a core tube; and to provide a method for heat-treating the wafer, by which the wafer can be heat-treated in high productivity by surely removing foreign matter. SOLUTION: The apparatus for removing foreign matter remaining in the heat treatment furnace in order to heat-treat the wafer is provided at least with: a nozzle for sucking foreign matter; a capture vessel for capturing the foreign matter sucked by the nozzle; and a pump connected to the capture vessel so that the foreign matter remaining in the heat treatment furnace is sucked by the pump through the nozzle and captured in the capture vessel. The method for heat-treating the wafer comprises the steps of sucking/removing foreign matter by the pump through the nozzle and heat-treating the wafer to be treated next. COPYRIGHT: (C)2007,JPO&INPIT