发明名称 MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND ASSOCIATED ASSEMBLIES AND METHODS
摘要 Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.
申请公布号 US2007105272(A1) 申请公布日期 2007.05.10
申请号 US20060617567 申请日期 2006.12.28
申请人 MICRON TECHNOLOGY, INC. 发明人 LEE TECK KHENG;CHAI DAVID YIH M.;NG HONG W.
分类号 H01L21/00;H01L21/44;H01L23/02;H01L23/48;H01L23/52 主分类号 H01L21/00
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