| 摘要 |
<p>A method of processing the silicon wafer used for solar cell comprises the following steps: a relative interval between the wafers is initially fixed, at the same time a silicon ingot or monocrystalline silicon rod is cut into wafers by a cutter; all wafers holding the relative interval are clamped by the clamps after the cutting step; the whole of the clamps clamping all silicon wafer is taken down, then an entire process of cleaning, etching, re-cleaning or replacing the clamps is performed. The processing method according to the invention shortens the period of the process compared with the prior arts. The processes of the wafer being taken out of and loaded in a space-stop rack piece by piece for several times and the wafer being loaded in a case are avoided, labor power and material resources are saved, and the percentage of damaging the silicon wafers and their corners are reduced. It's possible to allow a thinner silicon wafer to be cut, thereby improving greatly production efficiency and yield.</p> |
