PLASMA PROCESSING APPARATUS

摘要

A plasma processing apparatus is provided with a beam-like spacer (7) arranged on an upper opening of a chamber (3) which faces a substrate (2). The beam-like spacer (7) is provided with an annular outer circumference portion (7a) supported by the chamber (3) on its lower plane (7d), a center portion (7b) positioned at the center of a region surrounded by the outer circumference portion (7a) in plane view, and a plurality of beam portions (7c) radially extending from the center portion (7b) to the outer circumference portion (7a). The entire dielectric plate (8) is uniformly supported by the beam-like spacer (7). The dielectric plate (8) is thinned, while ensuring mechanical strength for holding atmospheric pressure when inside the chamber (3) is depressurized.