| 摘要 |
PROBLEM TO BE SOLVED: To increase the joining strength in a soldered electronic component, and to improve the operational reliability of electronic equipment in various using environments. SOLUTION: A trace amount of one or more selected from Fe, Ni and Co as elements for strengthening the joining boundary of solder are added, so that low reliability fracture in the solder joint by falling impact can be prevented. The solder alloy has a composition comprising, by mass, 0.1 to 5% Cu, 0.1 to 10% In, and one or more kinds of elements selected from Fe, Ni and Co by 0.002 to 0.05% in total, and the balance Sn with inevitable impurities. Alternatively, the solder alloy has a composition comprising 0.1 to 1% Ag, 0.1 to 5% Cu, 0.1 to 10% In, and one or more kinds of elements selected from Fe, Ni and Co by 0.002 to 0.05% in total, and the balance Sn with inevitable impurities. COPYRIGHT: (C)2005,JPO&NCIPI
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