发明名称 METHOD FOR JOINING METALLIC BALL
摘要 PROBLEM TO BE SOLVED: To provide a method for joining a metallic ball, by which heat generated in a small ball at the time of welding is efficiently dissipated. SOLUTION: In the method for joining a metallic ball, a shaft S having a receiving part S1 is set on a lower electrode 2, a recessed part 1c is formed on the bottom face of an upper electrode 1, a ball B is located on the receiving part S1 of the shaft S, a copper film 3 is arranged between the ball B and the upper electrode 1, and the ball B and the shaft S are joined by allowing electric current to flow between the upper electrode 1 and the lower electrode 2 while applying a pressurizing force to the copper film 3, the ball B, and the shaft S by means of the upper electrode 1 and the lower electrode 2. Further in this method, the lower electrode 2 is provided with a 2nd lower electrode 2s and a 1st lower electrode 2p movable relatively to the 2nd lower electrode 2s. The shaft S is set on the 1st lower electrode 2p. The recessed part 1c has an inner face IS formed into a hemispheric shape, and the ball B and the shaft S are joined by allowing electric current to flow between the upper electrode 1 and the 2nd lower electrode 2s in a state that the copper film 3 is in close contact with the ball B and the inner face IS in the recessed part 1c. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005046896(A) 申请公布日期 2005.02.24
申请号 JP20030282993 申请日期 2003.07.30
申请人 AISIN SEIKI CO LTD 发明人 ORI TETSUYA;KUROZUMI TAKASHI;AOYAMA TAKAMITSU
分类号 B23K11/00;B23K11/02;B23K11/30;(IPC1-7):B23K11/00 主分类号 B23K11/00
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