| 摘要 |
PURPOSE: A method for manufacturing a semiconductor package is provided to minimize a damage of a heat sink on a manufacturing process and to largely reduce a manufacturing cost. CONSTITUTION: A plurality of wiring patterns including a ball land(4) is formed on a circuit substrate unit(2). A circuit substrate strip(1) divided by a slot(5) as a border is formed by connecting the circuit substrate unit. Each heat sink unit(6) is attached to one side of each circuit substrate unit. After installing a semiconductor chip to each circuit substrate unit, the chip is connecting to the circuit substrate with a conductive wire. The chip and the conductive wire are encapsulated by a molding material. A conductive ball is melted on the ball land in the wiring pattern formed on each circuit substrate unit. Each semiconductor package is separated by sawing a circuit substrate strip into each circuit substrate unit. |
