| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a rolled copper foil suitable for a copper-clad laminate (especially a bilayered copper-clad laminate) to be subject to very fine pitch process as a construction material of a chip on flexible printed circuit board (COF), etc. <P>SOLUTION: The rolled copper foil for the copper-clad laminate is characterized by that it is a copper alloy of 0.05-0.25% Sn-added pure copper, contains 0 of 60 ppm or less, S of 10 ppm or less, total amount of Bi, Pb, Sb, Se, As, Fe and Te is 10 ppm or less, and its thickness is less than 18 μm. <P>COPYRIGHT: (C)2003,JPO |
