发明名称 Printed circuit board with embedded capacitors using hybrid materials, and manufacturing process thereof
摘要 The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
申请公布号 KR100716824(B1) 申请公布日期 2007.05.09
申请号 KR20050035626 申请日期 2005.04.28
申请人 发明人
分类号 H05K1/16 主分类号 H05K1/16
代理机构 代理人
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