发明名称 HEATING/COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heating/cooling device capable of reducing heat radiation in heating, and improving cooling efficiency in cooling. SOLUTION: An air vent valve 22 is mounted on a jacket portion 2 of a reaction kettle 1. A spatial chamber 3 is formed at an outer periphery of the jacket portion 2. A cooling fluid supply pipe 5 and the air vent valve 21 are connected with the spatial chamber 3. A vacuum communication pipe 20 is mounted at a right lower portion of the spatial chamber 3 in a state of being communicated with an ejector 10. When the reaction kettle 1 is heated, the steam for heating is supplied to the jacket portion 2, and the spatial chamber 3 is communicated with the ejector 10 to apply a prescribed vacuum condition, thus the heat radiation from the jacket portion 2 is prevented. In cooling, the cooling fluid is stored in the spatial chamber 3, so that the cooling fluid is sprayed into the jacket portion 2 from a nozzle. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006226541(A) 申请公布日期 2006.08.31
申请号 JP20050037509 申请日期 2005.02.15
申请人 TLV CO LTD 发明人 OOISHI SHIZUMARO
分类号 F25D7/00;B01J19/00 主分类号 F25D7/00
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