| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small multiple arrangement type wiring board on which a plurality of electronic components are mounted, which is accurately divided into wiring board regions. <P>SOLUTION: A frame 2 of ceramics is jointed to the upper surface of the outer peripheral part of an insulating base body 1 of ceramics where multiple wiring board regions 5 are arrayed in both vertical and horizontal directions at the central section. A metallized metal layer 7 is formed on the lower surface of the outer peripheral part of the insulating base body 1. Since the insulating base body 1 and the frame 2 are jointed through the metallized metal layer 8, the array line of the wiring boards near the outer periphery of the insulating base body 1 is effectively suppressed from deforming in arc. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
