发明名称 CONDUCTIVE FINE PARTICLE, METHOD FOR PRODUCING CONDUCTIVE FINE PARTICLE AND ELECTROLESS SILVER PLATING LIQUID
摘要 It is an object of the present invention to provide a conductive fine particle which can prevent conductive defects and makes it possible to reduce the connection resistance, a method for producing the conductive fine particle, and an electroless silver plating liquid used for the producing of the conductive fine particle. The present invention is directed to a conductive fine particle, which comprises: a base particle; a base layer made of nickel on the surface of the base particle; and a silver layer formed by electroless silver plating on the surface of the base layer, the purity of silver in the silver layer being 90 wt % or more.
申请公布号 EP1783783(A1) 申请公布日期 2007.05.09
申请号 EP20050768903 申请日期 2005.08.05
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 KUBOTA, TAKASHI
分类号 H01B5/00;C23C18/31;C23C18/52 主分类号 H01B5/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利