发明名称 |
CONDUCTIVE FINE PARTICLE, METHOD FOR PRODUCING CONDUCTIVE FINE PARTICLE AND ELECTROLESS SILVER PLATING LIQUID |
摘要 |
It is an object of the present invention to provide a conductive fine particle which can prevent conductive defects and makes it possible to reduce the connection resistance, a method for producing the conductive fine particle, and an electroless silver plating liquid used for the producing of the conductive fine particle. The present invention is directed to a conductive fine particle, which comprises: a base particle; a base layer made of nickel on the surface of the base particle; and a silver layer formed by electroless silver plating on the surface of the base layer, the purity of silver in the silver layer being 90 wt % or more. |
申请公布号 |
EP1783783(A1) |
申请公布日期 |
2007.05.09 |
申请号 |
EP20050768903 |
申请日期 |
2005.08.05 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
KUBOTA, TAKASHI |
分类号 |
H01B5/00;C23C18/31;C23C18/52 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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