| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sub-mount and a semiconductor device using the sub- mount, capable of preventing creeping up of a solder on an end surface of a semiconductor laser element. SOLUTION: A sub-mount 3 comprises a sub-mount substrate 4, a solder barrier film 7 which is formed on the surface of the sub-mount substrate 4 and comprises a plurality of end surfaces, and a solder film 8 which is so formed as to cover the upper surface of the solder barrier film 7 and comprises an end 10 which extends to outside from at least a part of a plurality of end surfaces of the solder barrier film 7.</p> |
