| 发明名称 |
THREE DIMENSIONAL PACKAGE OF CPU AND VOLTAGE REGULATOR/CONVERTER MODULE |
| 摘要 |
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator/converter die bonded to the CPU die in a three dimensional packaging layout. |
| 申请公布号 |
KR20070048260(A) |
申请公布日期 |
2007.05.08 |
| 申请号 |
KR20077007075 |
申请日期 |
2007.03.28 |
| 申请人 |
INTEL CORP. |
发明人 |
NARENDRA SIVA;WILSON HOWARD;GARDNER DONALD;HAZUCHA PETER;SCHROM GERHARD;KARNIK TANAY;BORKAR NITIN;DE VIVEK;BORKAR SHEKHAR |
| 分类号 |
G05F1/40;G05F1/56;G06F1/26;H01L25/16 |
主分类号 |
G05F1/40 |
| 代理机构 |
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代理人 |
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