| 摘要 |
<p>A silver paste composition which comprises A) a silver salt of an inorganic acid and/or a silver salt of organic acid, B) an organic binder, and C) a solvent, wherein the content of the silver derived from said component A) is 10 to 50 wt % relative to the total amount of said composition. The above silver paste composition is novel and can provide a silver thin film which has a thickness of 2.5 microns or less, is dense, is stable and exhibits a low sheet resistance value, and thus can be suitably used as a thin film conducting material for various electronic parts (a thin film electrode of a resistor) and a wiring material for a display device.</p> |
