发明名称 Semiconductor substrate and semiconductor circuit formed therein and fabrication methods
摘要 A semiconductor substrate and a semiconductor circuit formed therein and associated fabrication methods are provided. A multiplicity of depressions with a respective dielectric layer and a capacitor electrode are formed for realizing buried capacitors in a carrier substrate and an actual semiconductor component layer being insulated from the carrier substrate by an insulation layer.
申请公布号 US7214582(B2) 申请公布日期 2007.05.08
申请号 US20050523944 申请日期 2005.02.08
申请人 INFINEON TECHNOLOGIES AG 发明人 HOFMANN FRANZ;LEHMANN VOLKER;RISCH LOTHAR;ROESNER WOLFGANG;SPECHT MICHAEL
分类号 H01L21/8242;H01L21/02;H01L21/334;H01L21/84;H01L27/108;H01L27/12;H01L29/94 主分类号 H01L21/8242
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