发明名称 |
Imprinting-damascene process for metal interconnection |
摘要 |
The present invention first obtains a nano-metal line by an e-beam lithography and an electroless plating, and imprints the line into a material with low-K to obtain a damascene metal line with low cost and high throughput, as a future solution for a metallization process for a general low-K metal damascene structure through CMP.
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申请公布号 |
US7214611(B2) |
申请公布日期 |
2007.05.08 |
申请号 |
US20050208624 |
申请日期 |
2005.08.23 |
申请人 |
NATIONAL TSING HUA UNIVERSITY |
发明人 |
LIU JEN FU;HSU YUNG JEN;CHEN JIANN HENG;HUANG FON SHAN |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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