发明名称 Method of forming an electronic pressure sensitive transducer on a printed circuit board
摘要 The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
申请公布号 US7213323(B2) 申请公布日期 2007.05.08
申请号 US20050058939 申请日期 2005.02.16
申请人 INTERLINK ELECTRONICS, INC. 发明人 BAKER JEFFREY R.;SANCHEZ CARLOS S.;BAIR PATRICK H.
分类号 G01R3/00;G01L1/20;H01H13/702;H05K1/02;H05K1/11;H05K1/14;H05K1/16;H05K3/24;H05K3/30;H05K3/36 主分类号 G01R3/00
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