发明名称 |
Packaging assembly and method of assembling the same |
摘要 |
A packaging assembly includes a substrate; chip-site lands disposed on the first surface; first solder balls connected to the chip-site lands; second solder balls connected to the first solder balls including solder materials having higher melting temperatures than the first solder balls; a semiconductor chip having a plurality of bonding pads connected to the second solder balls on a surface of the semiconductor chip; and an underfill resin disposed around the first and second solder balls.
|
申请公布号 |
US7214561(B2) |
申请公布日期 |
2007.05.08 |
申请号 |
US20040902055 |
申请日期 |
2004.07.30 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TOMONO AKIRA;HOMMA SOICHI |
分类号 |
H01L21/00;H01L21/56;H01L21/60;H01L23/31;H01L23/485;H01L23/498 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|