发明名称 CONDUCTIVE PARTICLE MANUFACTURING METHOD, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
摘要 A method of production of conductive particles able to suppress growth of the conductive particles at the firing stage, able to effectively prevent spheroidization and electrode disconnection, able to effectively suppress a drop in electrostatic capacity, and able to efficiently produce core particles covered by thin coating layers without abnormal segregation of the coating layer metal particularly even when the internal electrode layers are reduced in thickness. A method of producing conductive particles comprising cores 51 having nickel as their main ingredients and coating layers 52 covering their surroundings. A core powder, a water-soluble metal salt containing a metal or alloy forming the coating layers 52, and a surfactant (or water-soluble polymer compound) are mixed to deposite by reduction a metal or alloy for forming the coating layers 52 on the outer surfaces of the core powder. The metal or alloy forming the coating layers 52 has at least one type of elements selected from Ru, Rh, Re, and Pt as a main ingredient.
申请公布号 KR20070048263(A) 申请公布日期 2007.05.08
申请号 KR20077007131 申请日期 2007.03.29
申请人 TDK CORPORATION 发明人 SUZUKI KAZUTAKA;SATO SHIGEKI
分类号 B22F1/02;B22F1/00;H01B1/22;H01G4/12 主分类号 B22F1/02
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