发明名称 Method for fabricating a thin film resistor
摘要 A method of fabricating high resistivity thin film resistors. An isolation region is formed on a substrate to isolate the active regions. A polysilicon layer is formed above the substrate. A diffusion barrier layer is formed above the polysilicon layer. Lightly doped ions are implanted in the polysilicon layer. The substrate is annealed at a high temperature. The diffusion barrier layer and the polysilicon layer are patterned to form a high-resistive thin film resistor. Spacers are formed on the sidewalls of the high-resistive thin film resistor.
申请公布号 US7212396(B2) 申请公布日期 2007.05.01
申请号 US20020072339 申请日期 2002.02.07
申请人 UNITED MICROELECTRONICS CORP. 发明人 WU BING-CHANG
分类号 H01G9/042;H01L21/02;H01L21/84;H01L27/06;H01L27/105;H01L27/12 主分类号 H01G9/042
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