Optical subassembly with a heat-radiating fin and an optical transceiver installing the same

摘要

The present invention provides a configuration to improve a heat-radiating effect of an optical subassembly having a co-axial package and a plurality of lead pins arranged in an arrayed shape. The heat generated inside the subassembly may be dissipated through the heat-radiating fin attached to a flat surface, not a curved side surface of the subassembly such that the lead pins provided in the subassembly pass through the slot provided in the heat-radiating fin. The heat-radiating fin has a slab portion attached to the cover of the transceiver, when the subassembly is installed within the transceiver. Thus, the heat generated in the subassembly can be easily and effectively dissipated to the cover.