发明名称 Sealed polishing pad, system and methods
摘要 A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.
申请公布号 US7210980(B2) 申请公布日期 2007.05.01
申请号 US20050213623 申请日期 2005.08.26
申请人 APPLIED MATERIALS, INC. 发明人 SWEDEK BOGDAN;LISCHKA DAVID J.;DAVID JEFFREY DRUE;BENVEGNU DOMINIC J.
分类号 B24B7/22;B24D99/00 主分类号 B24B7/22
代理机构 代理人
主权项
地址
您可能感兴趣的专利