发明名称 Process for producing a component module
摘要 A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another, embedding the components in a flexible material in order to form a flexible holding frame which holds the components, pulling off the film, producing contact-making elements on the exposed side of the components, performing a functional test of the components and, if necessary, repair and/or replacement of components, and fixing and making contact with the components held in the holding frame on the module carrier.
申请公布号 US7211451(B2) 申请公布日期 2007.05.01
申请号 US20020298772 申请日期 2002.11.18
申请人 INFINEON TECHNOLOGIES AG 发明人 MEYER THORSTEN;FRANKOWSKY GERD;HEDLER HARRY;VASQUEZ BARBARA;IRSIGLER ROLAND
分类号 H01L21/66;H01L21/00;H01L21/68;H01L23/28;H01L23/31;H01L23/498 主分类号 H01L21/66
代理机构 代理人
主权项
地址