发明名称 |
Pre-process before cutting a wafer and method of cutting a wafer |
摘要 |
A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.
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申请公布号 |
US7211500(B2) |
申请公布日期 |
2007.05.01 |
申请号 |
US20040950909 |
申请日期 |
2004.09.27 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
CHEN KUO-MING;WANG KUN-CHIH;LIU HERMEN;CHEN PAUL;HO KAI-KUANG |
分类号 |
H01L21/46;H01L21/301;H01L21/78 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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