摘要 |
An inspection system with a ring illumination apparatus (20) to illuminate one or more reflective elements (12), such as solder balls on an electronic component or other protruding surfaces or objects. The ring illumination apparatus (20) includes a substantially ring shaped light source (24) that provides even illumination across one or more reflective elements (12). An illumination detection device (30) detects light beams (32) reflecting off of the illuminated reflective elements (12) for forming a reflected image. There is a method using such an apparatus where it determines characteristics such as absence/presence, location, pitch, size, and shape of each reflective element.
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