发明名称 SYNTHETIC RESIN MOLDING MOLD, APPARATUS FOR AN METHOD OF ADJUSTING A TEMPERATURE OF THE MOLD
摘要 THERE IS PROVIDED AN ARRANGEMENT OF A MOLD INCLUDING A MOLD BASE (1), A CAVITY BLOCK (2) PROVIDED WITHIN THE MOLD BASE (1), A HEAT INSULATING LAYER (5) PROVIDED BETWEEN THE MOLD BASE (1) AND THE CAVITY BLOCK (2), AND A SYSTEM OF A FLOW PASSAGE (A) THROUGH WHICH A HEATING MEDIUM AND A COOLING MEDIUM ARE ALTERNATELY AND REPEATEDLY SUPPLIED, WHEREIN A SPACE IS PROVIDED AT A CONTACT PORTION BETWEEN THE CAVITY BLOCK (2) AND THE MOLD BASE (1) BASED ON ANTICIPATION OF A THERMAL EXPANSION OF THE CAVITY BLOCK (2). FURTHER, THE CAVITY BLOCK (2) MAY BE ARRANGED TO HAVE INLET AND OUTLET SLOTS COMMUNICATING WITH THE CHANNEL (A), AND THE INLET AND OUTLET SLOTS MAY BE ATTACHED WITH CONDUITS THERMALLY INSULATED FROM THE MOLD BASE (1).(FIG 1)
申请公布号 MY129709(A) 申请公布日期 2007.04.30
申请号 MYPI20001928 申请日期 2000.05.04
申请人 MITSUI CHEMICALS, INCORPORATED.;ONO SANGYO CO., LTD. 发明人 YOSIHISA SATOH;AKIHIKO IMAGAWA;MASAHIKO YAMAKI;MASATAKA TAKAMURA;MASAYUKI NUNOME;KAZUMI SHINTO
分类号 B29C33/04;B29C33/38;B29C43/20;B29C45/16;B29C45/73 主分类号 B29C33/04
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