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发明名称
REFLOW SOLDERING APPARATUS FOR FLEXIBLE PRINTED CIRCUIT BOARD
摘要
申请公布号
KR20070044552(A)
申请公布日期
2007.04.30
申请号
KR20050100612
申请日期
2005.10.25
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
MUN, DUEK GU
分类号
H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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