<p>Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.</p>
申请公布号
KR100715287(B1)
申请公布日期
2007.04.30
申请号
KR20060037672
申请日期
2006.04.26
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
BAEK, JOONG HYUN;KANG, SUN WON;KIM, MOON JUNG;BAEK, HYUNG GIL;LEE, HEE JIN