| 摘要 |
A liquid epoxy resin composition for underfilling a semiconductor device, and a semiconductor device prepared by using the composition are provided to improve adhesive strength, reliance and workability. A liquid epoxy resin composition comprises 5-50 wt% of an epoxy resin having at least two epoxy groups in a molecule; 5-50 wt% of a curing agent which reacts with the epoxy resin to form a cured product; 0.5-10 wt% of a curing accelerator which promotes the reaction of the curing agent; 20-80 wt% of an inorganic filler; and 1-10 wt% of a nitrobutadiene rubber-based additive represented by the formula, wherein R1 to R5 are independently H, a C1-C20 alkyl group or an aryl group; n and m are an integer of 0-10, but n and m cannot be 0 simultaneously; and x is an integer of 1-10.
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