COMPOSITE SUBSTRATE CARRIER

摘要

A WAFER CARRIER IS FORMED FROM AT LEAST TWO DIFFERENT MELT PROCESSABLE PLASTIC MATERIALS IN WHICH THE TWO PLASTIC MATERIALS RE STRATEGICALLY POSITIONED FOR OPTIMAL PERFORMANCE AND HAVING A THERMOPHYSICAL BOND CREATED DURING AN OVERMOLDING PROCESS. THE INVENTION INCLUDES CARRIERS MADEOF SUCH DIFFERENT MELT PROCESSABLE PLASTIC MATERIALS AND INCLUDES THE PROCESS FOR MANUFACTURING SUCH CARRIERS. IN A PREFERRED EMBODIMENT A H- BAR WAFER CARRIER (20) WILL HAVE A FIRST STRUCTURAL PORTION (44) MOLDED OF POLYCARBONATE IN A FIRST MOLD CAVITY AND WILL THEN HAVE THE POLYCARBONATE MOLDED PORTION (44) PLACE IN A SECOND MOLD CAVITY AND POLYETHERETHERKETONE WILL BE INJECTION MOLDED TO FROM WAFER CONTACT PORTIONS (46) ON THE H-BAR CARRIER. PROCESS TEMPERATURES AND MOLD TEMPERATURES ARE CONTROLLED TO PROVIDE OPTIMAL BONDING BETWEEN THE DISSIMILAR MATERIALS. THUS, AN INTEGRAL WAFER CARRIER (20) OF COMPOSITE MATERIALS IS FORMED. AN ADDITIONAL EMBODIMENT UTILIZED COMPONENTS SUCH AS SHELVES OR SIDEWALL INSERT FOR HOLDING WAFERS MOLDED OF TWO DISSIMILAR PLASTICS AND SAID COMPONENTS ARE ASSEMBLED WITHIN A DISK ENCLOSURE SUCH AS A TRANSPORT MODULE.(FIG. 1)