| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus which inhibits a substrate from receiving a damage due toγelectrons, recoil Ar ions and the like, while improving the efficiency of use of a target. SOLUTION: The apparatus comprises: a support plate 11 which faces to the rear surface of a target 2; a magnet plate 10 including a cathode magnet 12 supported by the support plate 11, of which the center is located apart from a normal line passing through the center of the support plate 11; a shield plate 21 that is installed in between the target 2 and a substrate 3 facing to the target 2, and has an aperture 22 provided therein which is in a position corresponding to the magnet 12 and of which the center is in a deviated position from the above normal line; a trap 20 containing a plurality of trap magnets 23 which are radially arranged around the aperture 22 so that the magnetic poles with the same polarity direct toward the center of aperture; and a drive mechanism which rotates the magnet plate 10 and the trap 20 around the above normal line relatively against the target 2, while keeping a fixed relative position of the aperture 22 with respect to the magnet 12. COPYRIGHT: (C)2008,JPO&INPIT
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