| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive adhesive composition for fixing an electronic component having excellent heat resistance, adhesiveness, and stress relaxation properties, and to provide its reactive adhesive sheet for fixing an electronic component. SOLUTION: The reactive adhesive composition for fixing an electronic component comprises an olefin copolymer (a) having an epoxy group in its molecule, and an olefin copolymer (b) having a carboxyl group in its molecule. The reactive adhesive composition further comprises a block copolymer (c) having an aromatic vinyl compound copolymer block (c1) and a conjugated diene compound copolymer block (c2). The reactive adhesive sheet for fixing an electronic component has an adhesive layer comprising the reactive adhesive composition formed on one or both sides of a base material. COPYRIGHT: (C)2008,JPO&INPIT
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