| 摘要 |
<P>PROBLEM TO BE SOLVED: To inspect a plurality of mounting states with high precision without complicating and enlarging the apparatus in a mounting system for mounting a component on a substrate. <P>SOLUTION: In this mounting state inspection method, an individual camera 13 is arranged to be able to shoot a plurality of inspection areas 1a on a transferred circuit board 1, and the transferred circuit board 1 is successively and temporarily stopped by an individual stopper 21 at each shooting position 31 according to the individual camera 13. Every time when the circuit board 1 is temporarily stopped at each shooting position 31, the camera 13 at the shooting position 31 shoots a corresponding inspection area 1a on the circuit board 1 temporarily stopped there, and the mounting state is inspected from the relation between the mounting position information X1, Y1 and the shooting position information X1, Y1 for each camera 13 on the circuit board 1, wherein the stopper position is used as the origin point O. <P>COPYRIGHT: (C)2007,JPO&INPIT |
