| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for bonding disk substrates with which the warp angle of the disk substrates can be efficiently adjusted. SOLUTION: The bonding apparatus 10 has such constitution such that two disk substrates d1, d2 bonded via an ultraviolet ray curable resin are irradiated with ultraviolet rays and the ultraviolet ray curable resin is cured, and is provided with an ultraviolet ray source 22 irradiating one side plane of a disk D with ultraviolet rays, and a ultraviolet ray polarizing means 21 provided at the middle of a path where the ultraviolet rays emitted from the ultraviolet ray source 22 travel to the disk substrate d2. In the ultraviolet ray polarizing means 21, difference of illuminance of ultraviolet rays emitted to the disk substrate d2 side is 50% or more. COPYRIGHT: (C)2007,JPO&INPIT
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