| 摘要 |
A bonding pad including an insulating layer, a pad metal layer, at least a patterned layer, a passivation layer and a conductive layer is described. The insulating layer is disposed on a substrate. The pad metal layer is disposed over the insulating layer. The at least a patterned layer is disposed in at least one of the positions of between the insulating layer and the substrate and between the insulating layer and the pad metal layer so that the in insulating layer or the pad metal layer has an uneven surface. The passivation layer is disposed over the pad metal layer. The conductive layer is disposed over the passivation layer, and the conductive layer is electrically connected to the pad metal layer.
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