METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING ENCAPSULANT
摘要
<p>A method of making a light emitting device is disclosed herein. The method includes the steps of: (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition having: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation. The method may further include the step of: (C) applying actinic radiation of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. The method may also include the step of: (D) heating the photopolymerizable composition to less than 150°C to further initiate hydrosilylation, or (D) simultaneously applying actinic radiation and heat.</p>
申请公布号
WO2007047260(A1)
申请公布日期
2007.04.26
申请号
WO2006US39540
申请日期
2006.10.10
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
BOARDMAN, LARRY D.,;THOMPSON, D. SCOTT,;LEATHERDALE, CATHERINE A.,;OUDERKIRK, ANDREW J.,