发明名称 METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE HAVING PLURALITY OF STORAGE NODE ELECTRODES
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of fabricating a semiconductor memory device having plurality of storage node electrodes. <P>SOLUTION: The method of fabricating the semiconductor memory device, includes a step of covering a mold insulating film portion over the plurality of storage node electrodes and one part of a semiconductor substrate, and forming a capping film exposing the mold insulating film portion located over the other portion of the semiconductor substrate, a step of selectively removing the mold insulating film using wet etching to expose sidewalls of the plurality of storage node electrodes covered by the capping film, and a step of removing the capping film using dry etching to expose upper portions of the plurality of storage node electrodes. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007110131(A) 申请公布日期 2007.04.26
申请号 JP20060279051 申请日期 2006.10.12
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KANG DAE-HYUK;OH JUNG-MIN;HONG CHANGKI;CHOI SANG-JUN;SHIM WOO-GWAN
分类号 H01L21/8242;H01L21/3065;H01L21/308;H01L27/108 主分类号 H01L21/8242
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