| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fine bump forming method indispensable to high density packaging, especially a bump forming method which is cheap as compared with cases based on a photolithographic technique and a plating technique, and is less subject to an environmental side since many chemicals and water are not used. <P>SOLUTION: The bump forming method comprises the steps of forming conductive resin layers covering a substrate and an electrode front surface on the substrate; removing the conductive resin layer on the substrate by a laser, while leaving the conductive resin layer on the electrode front surface on the substrate; and forming a bump consisting of conductive resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
