| 摘要 |
PROBLEM TO BE SOLVED: To provide a relay-fixing structure capable of preventing connection failure of a relay on a circuit board at fixing, even when using lead-free solder. SOLUTION: Of the relay fixing structure 1 formed by erecting a relay 2 equipped with a relay main body 2a, a terminal 4 extended and fixed to a lower part of the relay body 2a, and leg parts 6 on the circuit board 3, inserting the terminal 4 into a through-hole 7 of the circuit board, and by fixing the terminal 4 in the through-hole 7 with solder 5, the solder 5 is lead-free, and an interval H of 0.9 mm or larger is formed between the relay body 2a and the circuit board 3. The terminal 4 has preliminary solder 8, surface-formed from its tip to up to about a tip-corresponding position of the leg parts 6, on which the lead-free solder (5) is formed. COPYRIGHT: (C)2007,JPO&INPIT
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