| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy in which the reduction of liquidus temperature can be attained by the addition of In, and which can withstand a heat cycle accompanied by a temperature change from -40 to 1,250°C. SOLUTION: The solder alloy comprises, by mass, 12 to 18% In, and at least one kind selected from the following groups: (i) 2 to 2.8% Ag; (ii) 0.2 to 0.5% Cu; and (iii) 0.01 to 0.6% Co, and the balance Sn. COPYRIGHT: (C)2007,JPO&INPIT
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